• Call Cognex Sales: 855-4-COGNEX (855-426-4639)

  • Contact Us
Electronics

Electronics

Semiconductor Inspection

Machine vision inspects wafers and dice for defects

Semiconductor Inspection

Related Products

VisionPro

VisionPro

Empowers users to quickly set up and deploy even the most challenging 2D and 3D vision applications.

PatMax

Part Location with PatMax

Accurate and repeatable part and feature location technology

Machine vision is used throughout the semiconductor manufacturing process, from monitoring the diameter of ingots as they are being formed to inspecting a die lead frame prior to wire bonding. Though machine vision-enabled inspection is critical during all stages, specific back-end inspections at the die- and package-level help OEMs maintain strict quality standards.

PatMax technology locates and inspects surface defects like probe marks and IC marks; inspects bond pads, wires, and BGAs; locates cracks and chips that affect die quality; and helps provide real-time feedback to dicing machines. PatMax provides detailed defect data for inspection, independent of a die or package’s orientation, size, and shading variations. The use of machine vision for these inspections helps OEMs limit semiconductor defects and dramatically improve equipment yield.

For more information on Cognex application solutions:

GET ACCESS TO SUPPORT & TRAINING FOR PRODUCTS & MORE

Join MyCognex

HAVE ANY QUESTIONS?

Cognex representatives are available worldwide to support your vision and industrial barcode reading needs.

Contact Us